

Datasheet| Dimensions L x W | 36.83 x 26.67 mm |
| Pitch | 2.54 mm |
| Hole ? | 1.1 mm |
| Board thickness | 1.5 mm |
| Material type | FR4 Epoxide + chem. Au |
| Copper lamination | 35 μm double sided, plated through |
| No. of pins | 28 |
| Housing size | SOP28, SOIC28, SOIC28w, HSOP28, SO28 (1.27 mm) |