

Datasheet| Dimensions L x W | 33.66 x 21.59 mm |
| Pitch | 2.54 mm |
| Hole ? | 1.1 mm |
| Board thickness | 1.5 mm |
| Material type | FR4 Epoxide + chem. Au |
| Copper lamination | 35 μm double sided, plated through |
| No. of pins | 24 |
| Housing size | SOP24, HSOP24, SOIC24, SO24 (1.27 mm) |